Peregrine Semiconductor has announced the industry’s first RF SOI technology (UltraCMOS® 11 platform) built on GLOBALFOUNDRIES’ 300 mm RF technology platform. By moving to a 300 mm wafer, Peregrine opens the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform, which can leverage GLOBALFOUNDRIES’ 300 mm production-proven design enablement and manufacturing expertise and scale. This 300 mm fab in Singapore can provide new levels of performance, reliability and scalability for integrated RF front-end solutions.
The UltraCMOS 11 technology uses a custom fabrication flow from GLOBALFOUNDRIES' state-of-the-art Fab 7 facility in Singapore. This platform will be the foundation for Peregrine’s high volume mobile products and SOI products for other applications. It builds on the success of the award-wining UltraCMOS 10 technology platform, also developed and manufactured by GLOBALFOUNDRIES, and offers unparalleled performance and cost-competitive advantages.
