TSMC and MediaTek have announced their commitment to a long-term partnership to continue developing innovative products for Internet of Things (IoT) and wearable products with TSMC's industry-leading and most comprehensive ultra-low power (ULP) technology platform. In this platform, TSMC offers multiple processes to provide significant power reduction benefits for IoT and wearable products and a comprehensive design ecosystem to accelerate time-to-market for customers.
In January, TSMC and MediaTek achieved their first product milestone on this platform by launching MediaTek's MT2523 chipset for fitness smart watches. Built on TSMC's 55nm ULP technology, MT2523 is the world's first system-in-package (SiP) solution to offer GPS, dual-mode Bluetooth Low Energy, and a MIPI-supported high-resolution mobile screen.
TSMC's offerings of 55-nanometer ultra-low power (55ULP), 40ULP, 28HPC+, and 16FFC are ideally suited for a variety of smart and power-efficient applications in the IoT and wearable device markets.
