RJR Technologies announced that they have shipped over 10 million ACP packages. The ACP package enables the industry to adhere to copper bases, which has 30% better thermal performance, which provides the best-in-class watts/$ package for the RF power market. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.
According to Wil Salhuana, President and CEO of RJR Technologies - In today's highly competitive market, manufacturers are seeking solutions that support higher linearity, higher average output power and wider operating bandwidths keeping costs down. And the increased demand of ACP packages shows that manufacturers recognize them as a combination of high performance, low cost and faster time to market packages.
Based on RJR’s Liquid Crystal Polymer (LCP) technology, they feature an air cavity structure similar to a ceramic package to maximize electrical isolation of the silicon die. These packages employ an insert-injection molding process that combine a metal alloy lead frame with a LCP sidewall and matching lid with a pre-applied B-staged epoxy. The use of a lower temperature, compliant epoxy makes the package independent of the flange allowing manufacturers to use any of a wide variety of base/flange materials to meet specific CTE matching and thermal management requirements. As a result, ACP is the only packaging technology that allows designers to use lower cost, higher conductivity copper bases.
They have also begun to offer industry-standard QFN packages using its Liquid Crystal Polymer technology for applications such as automotive ignition systems, lighting and consumer microwave appliances.
RJR Technologies will be displaying their innovative RF and microwave packaging technology at the IEEE International Microwave Symposium (IMS2016), booth number 2146, from May 22 –27 in San Francisco.
