Amphenol Printed Circuits, a recognized leader in the printed circuit industry serving both military and commercial markets, will highlight its extensive design, manufacturing, and testing capabilities at the 2025 IEEE MTT-S International Microwave Symposium (IMS 2025). Attendees can visit booth #1126 at the Moscone Center in San Francisco to explore Amphenol Printed Circuits' innovative work in RF printed circuit boards, rigid-flex and flex assemblies, and high-performance backplanes.
Amphenol Printed Circuits will display its curated selection of products including advanced PCB solutions for commercial and defense applications, including high-speed digital (HSD) circuits supporting data rates up to 25 Gb/s, RF/microwave planar antenna arrays, beamforming networks operating up to 40 GHz and beyond, and hybrid assemblies integrating analog, digital, and RF/microwave technologies. These precision-engineered systems are designed, assembled, and tested at Amphenol Printed Circuits’ state-of-the-art facilities in Nashua, NH; Mesa, AZ; and Nogales, Mexico, providing full turnkey capabilities.
With over 30 years of experience, Amphenol Printed Circuits has been a trusted supplier of high-performance PCBs and backplanes for mission-critical military programs and demanding commercial platforms. By maintaining close partnerships with leading circuit material suppliers and leveraging Amphenol Printed Circuits' broad RF connector and component portfolio, Amphenol Printed Circuits delivers optimized interconnect solutions tailored to the most rigorous performance requirements.
Utilizing the latest low-loss materials—including rigid, flex, and rigid-flex constructions with low-profile copper—Amphenol Printed Circuits' cost-effective solutions address the evolving needs of aerospace, defense, space, industrial, and telecommunications markets.
Visit Amphenol Printed Circuits at booth #1126 during IMS 2025 to learn more about their products and services.
