Nuvotronics, an industry pioneer in high-performance RF and mmWave microelectronics, has developed a series of standard mmWave packages designed to deliver unmatched electrical performance, reliability, and thermal management in the mmWave spectrum from 15 GHz to 100 GHz. These packages, identified by part numbers ranging from PSP1028104 to PSP1028113, are built using Nuvotronics’ proprietary PolyStrata® 3D Microfabrication Technology, which enables breakthrough miniaturization, integration, and performance at frequencies up to 100 GHz.
These mmWave packages are designed to support the full mmWave spectrum from 15 GHz to 100 GHz, making them suitable for a wide array of mission-critical and high-speed applications, including defense systems, electronic warfare, 5G/6G infrastructure, commercial satellites, and advanced test and measurement platforms. By utilizing an air cavity structure and shielded micro-air coax interconnects, the packages achieve exceptionally low insertion loss and high return loss across ultra-wide bandwidths.
The models, PSP1028104 through PSP1028108, operate up to a frequency of 95 GHz and are optimized for extremely low insertion loss of 0.65 dB and consistent return loss of 12 dB, ideal for applications requiring ultra-low signal degradation at extremely high frequencies. The other variants from PSP1028109 through PSP1028113 operate up to 50 GHz and feature an even lower insertion loss of 0.3 dB, maintaining excellent return loss, while offering flexibility in die and package sizing for more compact designs.
The mmWave package family is offered in a scalable range of die and package sizes. The largest configuration (PSP1028104) accommodates die sizes up to 5.71 mm x 5.55 mm, within a 9 mm x 9 mm package footprint. Meanwhile, the smallest variant (PSP1028113) is compact enough to house a 1 mm x 1 mm die, in a 3 mm x 3 mm form factor, perfect for size-constrained applications. Each package maintains a die height of just 0.1 mm, while the package height ranges from 0.4 mm to 0.7 mm, keeping vertical profiles minimal. The number of DC pins scales accordingly, from 4 pins in the smallest variant to 16 in the largest, offering designers flexibility in I/O routing.
All packages are compatible with standard die attach and wire bond assembly, ensuring seamless integration into conventional manufacturing workflows. They also meet JEDEC J-STD-020 reflow standards, offering robust support for solder reflow and epoxy attach up to 150°C. The solid copper package construction provides high thermal conductivity up to 400 W/m·K, which not only enhances heat dissipation but also contributes to superior mechanical and electrical reliability, even in harsh operating environments ranging from -55°C to +125°C.
Device-specific mmWave packages are also available. The package part numbered PSP1025530_002 is compatible with Northrop Grumman's K-band low noise amplifier MMIC ALP302, and the package part numbered PSP1029439 is compatible with Qorvo's GaN-on-SiC Power Amplifier TGA2962.
At the heart of this innovation is Nuvotronics’ patented PolyStrata® 3D microfabrication process, which enables the creation of air-dielectric, copper micro-coaxial structures. This technique minimizes parasitics and signal loss while significantly improving isolation and frequency response. The result is a new class of mmWave packaging with 10x to 100x improvements in SWaP (Size, Weight, and Power) over traditional technologies.
With unparalleled electrical performance, miniaturization, thermal handling, and integration capability, these packages from Nuvotronics set a new benchmark for next-generation systems in both commercial and defense sectors.
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