Blueshift has developed the PhaseBlue® Series of Circuit Materials, which are lightweight, flexible PCB solutions designed for high-speed, high-frequency, reliable communications. PhaseBlue® Series Circuit Materials are innovative laminates engineered with a proprietary nanoporous polyimide core composed of 85% air and 15% organic polyimide. This aerogel-enabled core outperforms traditional PTFE-based PCBs and enables PhaseBlue materials to provide lightweight, excellent survivability with extreme temperatures, formability that supports tight bends to create 3D shapes, and process compatibility with FR-4 materials.
Limitations of Traditional PTFE-Based Substrates
Perfluorinated substrates (PTFE-based) have been the market leaders in high-frequency PCB design and manufacture for decades. Their low dielectric constant (Dk) values and excellent dissipation factor (Df) performance drove rapid adoption across the industry. However, several significant drawbacks limit their long-term viability.
Dielectric Instability: PTFE-based substrates typically undergo a conformational change in the polymer chains at, or near, room temperature, altering dielectric properties and negatively impacting both Dk and Df. Structural modifications, such as incorporating ceramic fillers or reinforcing fibers, can improve processibility. However, these often raise the Dk value, slowing signal transmission, decreasing efficiency, and reducing flexibility and diminishing Df performance.
Thermal and Chemical Limitations: PFAS-based materials start to decompose at 260 °C, weakening the substrate structure and introducing potential failure points. Decomposition can also release toxic hydrogen fluoride (HF), creating additional safety and environmental concerns.
Bonding Challenges: PTFE materials have an inherently low surface energy and a slippery nature, making them notoriously difficult to bond reliably with other materials and complicating manufacturing processes.
Regulatory Pressures: Impending restrictions on the use of perfluorinated materials in both the US and EU are further accelerating the search for PTFE alternatives. Electronics manufacturers are increasingly prioritizing high-performing, PFAS-free substrates that meet both technical and regulatory demand.
How PhaseBlue Circuits Materials Outperform PTFE-based Substrates?
Constant Dk values and Tg properties: With an exceptionally low Dk of 1.3 – 1.5 at 1 GHz, which remains constant across a frequency range of 1 to 10 GHz, and Tg of 305 °C, this value is significantly higher than most PTFE-based materials, PhaseBlue materials exhibit impressive thermal stability during processing and operational activities. Importantly, the ‘dielectric knee’, a common drawback of perfluorinated substrates, is not seen under high temperatures.
Lightweight and flexible: As well as superior Dk and Df behaviors when compared with the market leaders, PhaseBlue® maintains flexibility under a range of conditions enabling facile application across topologically uneven surfaces. Finally, the nanoporous structure means that PhaseBlue® materials have a density of < 0.45 g/cm3, lower than that of leading competitors, rendering them ultra-lightweight. PhaseBlue materials have a thickness range of 0.0065 to 0.030 inches, which is less than a 1 mm.
Potential of PhaseBlue Series Circuit Materials for High-Frequency Application
Designed specifically for high-frequency PCB applications, PhaseBlue®-based substrates provide measurable improvements in Dk, Df, weight, and flexibility relative to current industry state-of-the-art, offering clear operational advantages and outperforming competitors across several key technical areas. Specifically designed to comply with slash sheet IPC-4202C, this US-designed and made PCB material has application across a range of communication devices, including patch and phased-array antennas and radomes, CubeSats and small satellites, UAV antennas, aerospace and high-speed communications.
Click here to learn more about PhaseBlue Circuits Materials from Blueshift.
