News for LPKF Laser & Electronics
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RF circuits have a firm place in technical applications. They require precise geometric layouts to achieve reliable results. At the European Microwave Week (EuMW 2024) in Pari... Read More
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Active Mold Packaging (AMP) is a novel interconnect technology for IC packaging. Here, the previously unused areas of the epoxy mold compound (EMC) of an IC package is convert... Read More
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To remain competitive in the field of the Internet of Things, even medium-sized industrial and process metrology companies need to increasingly integrate their sensor circuits... Read More
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LPKF, a manufacturer of laser and machine PCB Prototyping Machines and other advanced equipment for research and development and manufacturing, has announced that they’ll be e... Read More
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Challenging demands accompanied by increasing device densities and extension of frequency bands mean that flexible approaches are needed to functionalize existing installation... Read More
