Cirexx International has announced that they have provided advanced antenna Printed Circuit Board Assembly designs incorporating Rohacell foam. The Rohacell foam, made by Evonik Industries of Austria, is a fiber-composite that provides a superior low-loss barrier (better than air) between the radome and the elements in an antenna system. Cirexx has incorporated the foam into advanced RF/Microwave Printed Circuit Board structures with accompanying heat sinking and chassis hardware.
These antennas are commonly used in commercial and military aircraft, including UAVs (unmanned aerial vehicles). The technology is also being used in communications (cellphone/broad band) equipment. The Rohacell foam is light-weight, has excellent dynamic strength, high temperature resistance (up to 220°C) and is easily machined. Cirexx engineers have developed several methods of attaching the foam to PCBs.
