IMS 2024 Day-5 Highlights: Technical Sessions, Workshops, Panel Discussions, Closing Sessions and More!

IMS 2024 Day-5 Highlights: Technical Sessions, Workshops, Panel Discussions, Closing Sessions and More!

The International Microwave Symposium (IMS) 2024 is bringing together experts, innovators, and professionals from the microwave and RF industries. This premier gathering features a rich technical program, cutting-edge exhibitions, and valuable networking opportunities, setting the stage for a week of insightful discussions and groundbreaking advancements in microwave technology. The event has exciting features lined up for Thursday i.e. 20th of June, promising engaging workshops, thought-provoking panels, and interactive sessions.

IMS Technical Sessions

  • Advances in CAD Techniques for RF and Microwave Circuits and Systems (Chair: José E Rayas-Sánchez, ITESO; Co-Chair: Marco Pirola, Politecnico di Torino)

  • Advanced mm-Wave Power Amplifiers for Ka- to E-Band Applications (Chair: Michael Roberg, mmTron; Co-Chair: Munkyo Seo, Sungkyunkwan University)
  • Low-Noise Cryogenic Integrated Circuits for Quantum Computing (Chair: Kavita Goverdhanam, US Army CCD-C5ISR Center; Co-Chair: Sorin P. Voinigescu, University of Toronto)
  • Insights on Vital-Sign Radars (Chair: Alexander Koelpin, Technische Universität Hamburg, Germany; Co-Chair: Davi V. Q. Rodrigues, University of Texas at El Paso)
  • Who Needs Contact? Developments in OTA Measurements (Chair: Marcus Da Silva, National Instruments; Co-Chair: Marco Spirito, Technische Universiteit Delft)
  • Advances in Reconfigurable Intelligent Surfaces, Antennas, and Beamformers (Chair: Nizar Messaoudi, Keysight Technologies; Co-Chair: Najme Ebrahimi, Northeastern University)
  • Device and Integration Technology for RF through mm-Wave (Chair: Shahed Reza, Sandia National Laboratories; Co-Chair: Ko-Tao Lee, Qorvo)
  • HF Through UHF Techniques and Applications (Chair: Frederick H. Raab, Green Mountain Radio Research; Co-Chair: Marc Franco, Macom)
  • Sub-Thz Power Amplifiers for D-Band and Beyond (Chair: David Brown, BAE Systems; Co-Chair: Sensen Li, University of Texas at Austin)
  • Advances in Quantum Technologies (Chair: Yanghyo Rod Kim, Stevens Institute of Technology; Co-Chair: Dimitris Pavlidis, Florida International University)
  • Advances in Microwave Biomedical Applications (Chair: Christian Damm, Universität Ulm; Co-Chair: Chung-Tse Michael Wu, Rutgers University)
  • Near-Field Wave-Matter Interaction (Chair: Kamel Haddadi, Université de Lille; Co-Chair: Malgorzata Celuch, QWED)
  • Advancing Characterization at mm-Wave Frequencies (Chair: Shuhei Amakawa, Hiroshima University; Co-Chair: Ricardo Figueiredo, Universidade de Aveiro)
  • Advanced Circuits and Techniques for Next-Generation Wireless Systems (Chair: Kenneth E Kolodziej, MIT Lincoln Laboratory; Co-Chair: Marcus Pan, Semiconductor Research Corporation)
  • GaN Devices and Technology for Wireless Applications (Chair: Wolfram Stiebler, Raytheon; Co-Chair: Peter Magnee, NXP Semiconductors)

Industry Workshops

  1. Machine Learning (ML) and Analysis Advancements Embedded in a Complete High-Frequency Design Flow  Increasing design and system complexity require designers to consider individual designs within the larger system earlier in the design flow to maximize system performance. Cadence’s complete design flow with EM and Thermal Analysis is the backbone infrastructure needed for the next generation of designs. This workshop will review the complete flow and introduce the audience to the ML capabilities within the Virtuoso flow to aid designers in satisfying increased requirements and exploring additional solutions. (Speakers: Michael Thompson, Sanam Vakili, Claudia Roesch, Kerry Judd, Ron Pongratz, Cadence Design Systems)
  2. Design Flow for the Assembly and Analysis of 3D Heterogenous Integrated Technologies – What happens to your chip’s performance when it is placed in the package? How close is “too close” when placing multiple chips next to each other? Does the loop height of that bond wire impact your RF output? Does the void in the board below your chip impact the operating bandwidth? Wouldn’t you like to know BEFORE you go to manufacturing? Now you can! Here is a design flow that is built to do 3D Heterogenous Integration and it can be easily integrated with several EDA tools including ADS, Virtuoso, Custom Compiler, and Tanner. (Speaker: Nathan Altaffer, Keysight Technologies)
  3. FPGA-Accelerated Deep Learning for 5G FR2 Channel Estimation  Ever-increasing demand for high throughput, low latency, and ultra-reliability in wireless transmission requires accurate channel estimation under impairment conditions including Doppler shifts and noise. This workshop will demonstrate a convolutional neural network (CNN) for channel estimation using OTA measurements through mmWave PAAM and AMD RFSoC-based 5G NR receiver in a CATR chamber. Training is accelerated by combining MATLAB with hardware-based channel impairments including AWGN and variable carrier-frequency offsets. (Speakers: Luc Langlois, Avnet; Fabrício Dourado, Rohde & Schwarz; Yoshiharu Fujisaku, Fujikura; Noam Levine, MathWorks)

Panel Sessions

IMS Panel Session

  • Weather vs Wireless: How Do We Balance the Use of Critical Microwave Bands? – A recent high-profile spectrum conflict has been between weather forecasters and the wireless industry on the use of passive microwave spectrum. While both sides are addressing critical economic and societal needs, there are many questions about the possibility and impacts of coexistence, especially related to 50-58 GHz, which will be considered at the World Radiocommunication Conference 2027. This panel discussion will feature high-level panelists from across the public, private and NGO sectors to discuss the increasing demand for passive microwave spectrum for both wireless tech and meteorology. The discussion will seek to foster more productive science and engineering discussions on these topics and highlight possible solutions for coexistence. (Organizers: Renee Leduc, Narayan Strategy; Paolo de Matthaeis, NASA Goddard Space Flight Center; Beau Backus, Applied Physics Laboratory at Johns Hopkins University)

Startup Panel Session

Voice of the Customer Panel Session - This panel is comprised of active investors, program managers, and large primes (pending), sharing keen insights into how startups can break into doing business with their organizations. (Panelists: Theo Williams, Third Vector; Sherman William, AIN Ventures; David Beck, U.S. Space Force; Ian Adams, NASA)

IMS Closing Session

Real-world Performance Measurements of Cellular Networks Using Smartphones – As 5G deployments increase in the newly allocated mid-band and mmWave spectrum, and discussions on 6G begin, it is important to characterize real-world performance of the enhancements made to 5G to determine how best to design the next generation of cellular networks. For example, how well does massive MIMO work in the real world? How is sharing in CBRS performing? This talk will present recent results from detailed measurements of 4G and 5G in the various bands: mmWave (> 24 GHz), mid-band (2.5 – 3.98 GHz) and CBRS (3.55 – 3.7 GHz). (Keynote Speaker: Monisha Ghosh, Professor of Electrical Engineering, University of Notre Dame and Former Chief Technology Officer at the Federal Communications Commission (FCC))


Click here to view the Day-3 highlights of IMS 2024.

Click here to view the Day-4 highlights of IMS 2024.

Click here to view everything RF's coverage of IMS 2024. 

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