Rogers Corporation will exhibit at the 2016 IEEE International Microwave Symposium (IMS) from May 24-26, at the Moscone Center in San Francisco, CA. The IEEE IMS event is the microwave industry’s largest international gathering of RF/microwave professionals, with over 600 exhibition booths and more than 8,000 attendees expected.
As part of the MicroApps Session, John Coonrod, Rogers’ Technical Marketing Manager, will lead two presentations on the proper selection of circuit materials for microwave frequencies and beyond.
Presentation #1: For those wishing to know more about incorporating flexible circuit materials into their next RF/microwave design, “High Frequency Circuits Which Bend and Flex” is Tuesday, May 24th, at 12:30 pm.
Presentation #2: For attendees interested in serving the growing demand for millimeter-wave circuits in such applications as automotive safety systems and Fifth Generation (5G) wireless systems, “Circuit Material Selection for Millimeter-Wave Applications", is Tuesday, May 24th, at 3:00 pm.
As a founding member of the RF Energy Alliance, Rogers joined with a group of like-minded companies dedicated to realizing solid-state RF energy’s true potential as a clean, highly efficient and controllable heat and power source. Learn how This Alliance aims to reduce system cost and increase market adoption and growth through standardization of solid-state RF energy components, modules and application interfaces. Dr. Klaus Werner, Executive Director of RF Energy Alliance, will be available at the Rogers booth on Wednesday, May 25th, at 1PM to discuss this technology.
They offer a variety of material options that are specifically engineered to help manage the thermal challenges that today’s RF engineers face. From PTFE based RT/duroid 6035HTC, TC350 and TC600 laminates to thermoset materials 92ML laminates and 92ML StaCool laminates, they provides a large toolbox that offers many viable options.
RT/duroid 6035HTC laminates offer the highest performance available with a thermal conductivity of 1.44W/mK in combination with a super low loss of 0.0013 at 10GHz. TC350 and TC600 laminates offer an excellent combination of thermal conductivity (1.0-1.1W/mK), low loss (0.0020 at 10GHz), and cost effectiveness.
Their 92ML Series materials offer extreme thermal management in a lower cost modified epoxy based thermoset system with a high thermal conductivity (2.0W/mK), high Tg (160°C), and halogen free flame retardancy. The 92ML StaCool laminates are an Insulated Metal Substrate (IMS) version of the 92ML series laminate to enable the highest heat dissipation configuration available.
They also offers COOLSPAN TECA adhesive as an option for designers to use when bonding heat sinks to board materials. This modified epoxy assembly adhesive has a thermal conductivity of 6W/mK in a lead free capable, thermally stable system.
RO4835 laminates, with a dielectric loss tangent of 0.0037 at 10 GHz, are now available with their proprietary LoPro reverse treat copper foil. These materials are ideal for applications requiring low insertion loss characteristics. This foil provides reduced electrical variability due to its smoother copper surface, maintaining consistent performance for reliable broadband signal delivery from Digital through RF and microwave frequencies. In addition, RO4835 laminates provide ten times improved oxidation resistance compared to RO4350B laminates.
Visit booth #2039 to see and learn more about Rogers products.
See the IMS 2016 Coverage on everything RF.
