Northrop Grumman to Showcase its High Power Chipsets at IMS 2016

Northrop Grumman will be showcasing their expertise in microelectronics innovation and high performance communications applications at the International Microwave Symposium 2016 in San Francisco from May 24-26, 2016, at booth 731.

Advancements in compound semiconductor technology have a significant impact on global security and communications markets, affecting a broad range of products from radar systems to satellite systems to mobile devices. Their engineers will present on high power and high efficiency chipsets for Ku-Band, Ka-Band, V-Band, Q-Band, E- and W-band communications, and on optimizing ground, airborne and space-based communication links using their advanced semiconductor products and technologies.

Building on the company's reputation for transitioning leading edge communications products into everyday use, they will present several new semiconductor products including high power amplifiers and enhanced gallium nitride manufacturing options. Stop by booth #731 to learn more.

Publisher: everything RF