Outsourced semiconductor assembly and test (OSAT) services expert, Amkor, is now leading the way for 5G mmWave antenna-in-package (AiP) technology. Its cutting-edge technology has already been deployed into modules designed for smartphones and other mobile devices. Starting in July 2018, Amkor was the first OSAT to market with 5G mmWave AiP technology, expanding on years of advanced System-in-Package (SiP) experience.
According to Ron Huemoeller, Corporate VP of R&D for Amkor Technology, Amkor has deployed the AiP technology into 5G product applications with a major global communications company, working with them to produce their first AiP product to go to market. According to Yole Développement, an industry consulting firm, the total RF front-end module SiP market is projected to reach US $5.3 billion by 2023, representing an 11.3% CAGR. Yole experts believe that 5G will bring more packaging business for OSAT providers. Typical RF front-end components in smartphones include various switches, filters, amplifiers and the antennas themselves. More and more, SiP technology is needed to implement an increasing number of bands and the development of circuitry in ever-smaller surfaces.
In addition to its formidable SiP capacity and AiP technology, Amkor has developed an extensive toolset to maximize circuit density and address the sophisticated packaging formats required to productize 5G applications – such as double-sided assembly, embedded die in substrate, advanced RDL molding and various types of RF shielding. This toolset, combined with the company’s expertise in RF and antenna package design, uniquely positions Amkor to serve customers who want to outsource the challenges and high investment associated with combining multiple ICs with advanced package assembly and test technologies for 5G networks.
As demand for packages that support 5G starts to climb, Amkor is already well underway with the successful implementation of AiP technology. Click here to know more about Amkor's capabilities in AiP.
