Probe Testing of Wafer Level Chip Scale Packaging
High Frequency Electronics, Teradyne
Wafer Level Chip Scale Packaging (WLCSP) has enabled smaller and thinner semiconductor devices with greater functionality to be used in consumer mobile applications such as smart phones, tablets and hand held GPS tracking devices. There is an accelerating trend toward wafer level chip scale packaging, with estimates placing growth at 26% CAGR for 2011 (Yole Marketing, 2011). WLCSP has lead the way to reduced cost of complex semiconductor devices through simplified packaging and a reduction in the number of touches in the semiconductor test process. Paradoxically, simplified WLCSP packaging demands have increased the demands on the test cell, including the test system, wafer prober and the interface to the device under test.
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