Innovative Packaging Puts Multiple Technologies into a Single Device
High Frequency Electronics
The technique of assembling individual ICs on a semiconductor or insulator substrate instead of a p.c. board is becoming the new standard in components. The resulting single “super component” can be handled like any other component in a production environment, including tape-and-reel delivery and automated assembly. The other primary advantage of these SoC devices is that they capture specific expertise at the source. In one case, the designers and suppliers of these devices can be highly specialized in the circuitry involved. In the other, they can be packaging experts who handle difficult matters of placing the ICs, then manufacturing and testing the finished SoC modules. In either case, the OEM that is designing a product around the SoC does not need to have the particular expertise in-house.
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