EDI CON China 2018 event will bring together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities in the field of electronic design innovations. The event will be held from March 20 - 22, 2018 in Beijing, China.
The EDI CON brings solutions, products, and design ideas that can be put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, with the special focus on EMC and Radar through its partnerships, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges.
