TSMC, the largest semiconductor foundry company in the world has announced its intention to build and operate an advanced semiconductor fab in the United States.
The new facility will be built in Arizona, and will utilize TSMC’s 5-nanometer technology for semiconductor wafer fabrication. The fab will have a 20,000 semiconductor wafer per month capacity and result in the creation over 1,600 high-tech professional jobs directly, and thousands of indirect jobs in the semiconductor ecosystem. Construction is planned to start in 2021 with production targeted to begin in 2024. TSMC will spend approximately US$12 billion from 2021 to 2029 on thie project.
This U.S. facility will not only enable them to better support their customers and partners, but it will also gives them more opportunities to attract global talent. This project is of critical, strategic importance to a vibrant and competitive U.S. semiconductor ecosystem and will enable leading U.S. companies to fabricate their cutting-edge semiconductor products within the United States and benefit from the proximity of a world-class semiconductor foundry and ecosystem.
In the United States, TSMC currently operates a fab in Camas, Washington and has design centers in both Austin, Texas and San Jose, California. The Arizona facility would be TSMC’s second manufacturing site in the United States.
