3D Glass Solutions (3DGS), an innovative pure-play glass foundry, announced that its main LC-IPDprocess line on APEX® photosensitive glass ceramic is ready for volume production. APEX® Glass is not like traditional glasses. It contains special sensitizers that allow unique anisotropic 3D features to be formed through a simple exposure step. This “photo-structurable glass” combines batch manufacturing processes with standard IC processing toolsets to provide a low-cost, high-volume, production solution. APEX® Glass’ microfabrication ability is ideally suited for the wafer level packaging of electronic packages. Applications span many industries including 2.5D and 3D packaging, RF packages (inductors, antenna, etc.), optoelectronics, and microcavities among others.
Complete with the proven LC-IPD PDK and design guide available with Cadence, the company offers demonstrated superior RF performance in a compact device size with excellent simulation to measurement matching. With the new facility online and proven design-to-product flow, rapid prototyping is available with a proven path to high volume production.
“RF applications are constantly evolving,” says Jeb Fleming, CTO and Founder. “New designs are frequently mandating lower loss and cost, in an ever-shrinking package size. By providing the RF community with a proven design-to-production flow, we are enabling fast-turn product development in an in-demand technology platform that combines industry leading RF filter performance with increased system-level integration. We are now ready to assist customers with their challenging custom designs.”
The glass ceramic based IPD technology is a low loss RF platform technology that significantly reduces power consumption in RF devices. Featuring High-Q inductors with Q-factors over 90 and high-Q capacitors with values over 250, the IPD technology node is ideally suited for frequencies between 0.1 and 10 GHz. Additionally, the integration of through glass vias enables the integration of system-level components onto the glass package, further increasing system-level integration. 3DGS’ locked process flow significantly shortens manufacturing throughput time for reduced time to market. The technology node’s high yield, scalable process delivers a high correlation between simulation and final product for expedited product development. Designed in a compact, highly integrated electronic package, the IPD technology node can be used for the creation of:
IPD PDK :
IPD PDK - seamless design flow from schematic layout to full 3D EM analysis and production. Developed in partnership with Cadence's AWR software team, this PDK has been built to work exclusively under the AWR Analyst environment. Cadence Microwave Office Version 16.01 or later and a valid license key from Cadence are necessary to use the PDK. Leveraging 3D Glass Solutions' industry-leading photo sensitive glass manufacturing techniques, users can create complete custom devices with accurate RF modeling of device performance. By leveraging this tool, designers can build an IPD product with full 3D simulation in days.
APEX® photosensitive glass ceramic :
APEX® Glass is not like traditional glasses. It contains special sensitizers that allow unique anisotropic 3D features to be formed through a simple exposure step. This “photo-structurable glass” combines batch manufacturing processes with standard IC processing toolsets to provide a low-cost, high-volume, production solution.
APEX® Glass’ microfabrication ability is ideally suited for the wafer level packaging of electronic packages. Applications span many industries including 2.5D and 3D packaging, RF packages (inductors, antenna, etc.), optoelectronics, and microcavities among others.
Click here to learn more about IPD PDK.
3DGS attended the International Microwave Symposium, last month in Denver, Colorado. Click here to see everything RF's coverage of IMS 2022.
