StratEdge, a leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally efficient line of post-fired and molded ceramic semiconductor packages in Booth 2628 at the International Microwave Symposium (IMS), being held in San Diego, CA, from June 13-15. Stop by their booth to learn about StratEdge packages that operate across the spectrum from DC to 63+ GHz, while efficiently dissipating heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These clever packages enable compound semiconductor devices to meet stringent requirements in applications such as defense, satellite, test and measurement, automotive, and down-hole.
"For decades, StratEdge has been a passionate supporter of IMS, and this year is no exception. Our team of experts is looking forward to meeting you face-to-face and delving into your high-frequency, high-reliability, high-power packaging needs," exclaimed Casey Krawiec, VP of global sales at StratEdge. "Our molded ceramic packages are a nifty solution for space and defense applications and can be manufactured with thermally enhanced metal bases that ensure efficient heat dissipation. Our post-fired ceramic packages are well known for their electrical transition designs that minimize electrical losses to an extraordinary degree. And that's not all—we have our state-of-the-art cleanroom, equipped with the latest precision wire bonding and die attach systems, along with our decades of microelectronics assembly experience. We are your premium turn-key assembler of high-frequency devices."
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