Skyworks Introduces Multi-Band, Multi-Chip System-in-Package (SiP) for 5G Massive IoT Applications

Skyworks Introduces Multi-Band, Multi-Chip System-in-Package (SiP) for 5G Massive IoT Applications

Skyworks Solutions has introduced the SKY66431-11, a multi-band, multi-chip system-in-package (SiP) designed to support 5G massive IoT across LTE-M and NB-IoT platforms. This SiP is based on the Sequans Monarch SQN3430 chipset and integrates different processing capabilities on a single substrate.

The SiP has been designed to be compliant with 3GPP Release 14 and can be further upgraded to support 3GPP Release 15 and 16. It is also pre-certified with FCC, ISED/IC, RED, UKCA, ACMA, and GCF/PTCRB, and other MNOs, offering worldwide operation and connectivity with enhanced features. The chip supports both low-band (B5, B8, B12, B14, B17, B18, B19, B20, B26, B28, B85) and mid-band frequencies (B1, B2, B3, B4, B25, B66), providing a global frequency band support.

The SKY66431-11 consists of a compact LTE modem and RF front-end in a single package. It includes a baseband unit, transceiver, RF front-end (with switches, amplifiers etc.), RAM memory, crystals, and power management units. The chip is optimized to transmit and receive signals in half-duplex fashion (HD-FDD) to support LTE-M and NB-IoT.

The multi-chip system offers positioning capabilities over LTE with an embedded low-power GNSS chip, eliminating the need for an external GNSS chipset for intermittent tracking. It also provides a cloud-based solution to process data from indoor/outdoor positioning operations.

The SKY66431-11 delivers a data rate of up to 300 kbps (DL) and 1.1 Mbps (UL) over LTE-M. In NB-IoT mode, it delivers a data rate of 120.77 kbps (DL) and 160 kbps (UL). It requires a single DC supply from 2.8 V to 5.5 V and has an extremely low leakage internal that enables operability for 20 years. This RoHS/REACH-compliant chip is enclosed in a ball grid array (BGA) package that measures 8.8 x 11.3 x 1.585 mm with MSL3 rating at 260°C.

The SiP is ideal for various low-power applications such as wearable medical devices, fleet management, industrial monitoring devices, security/alarm systems, e-bike tracking, personal tracking, and low-power IoT devices.

Click here to learn more about SKY66341-11 multi-chip SiP.

Publisher: everything RF
Tags:-   SiPModemIoT