Sivers Wireless, a subsidiary of Sivers Semiconductors has received another order in the lower thousands of units from its Tier-1 5G infrastructure customer for beamformer and up/down converter chips that will be used in the next product prototype built by the customer. The order value in itself is not significant, but this order brings this project one step closer to the final product ramp and volume orders.
This project has been ongoing with this customer since MixComm was acquired and has had changes to designs and time plans over this period. The first prototype order was received in 2022, and based on the first product prototype build, the second version is planned for 2H 2023.
“It is challenging with new technology to get to market, and in this case, the customer has decided over time to make configuration changes to the final product that have nothing to do with Sivers. However, we are now very happy to see progress in this vital project, which has the potential to be one of the 5G Wireless projects with larger revenues when it is finalized by the customer," said Anders Storm, CEO of Sivers Semiconductors.
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