The ALT1350 Wireless System on Chip (SoC) from Sony Semiconductor Israel (Sony), a leading provider of cellular IoT chipsets is now commercially available. This chipset has been developed to answer the evolving and growing needs of the cellular LPWA IoT market. It’s the world’s first cellular IoT chipset to additionally enable unlicensed spectrum communications protocols, as well as satellite connectivity (NTN) in a single chipset. These abilities enable a synergy of faster development, lower power, smaller size, resulting in reduced costs to optimize use cases and emerging new trends.
LPWA cellular modules are designed by Sony’s partners and industry leaders such as AM Telecom, Fibocom, Murata, Quectel, Semtech, Telit Cinterion and Wistron NeWeb Corporation (WNC). The modules based on this new chipset are available now for sampling with mass production expected during the first half of 2024.
Sony’s Altair ALT1350 is the first cellular LTE-M/NB-IoT SoC to adopt a low-power application MCU, a sensor-hub for data collection and processing, enhanced security, integrated SIM (iSIM) location technology and an additional sub-GHz LPWA/FAN customizable transceiver and NTN communication options in a single chip. It features cellular connected standby mode (eDRX) connectivity at a power consumption of below 3µA, and its overall power consumption performance achieves up to 10 times longer battery life compared to previous generations. The rich feature set and performance of the chipset makes it an ideal solution for smart utility meters and single-chip asset-tracking applications.
The ALT1350 chipset promises unparalleled connectivity options and can support connectivity choices for all industries and markets. In smart cities and utility spaces, the ALT1350 can perform as a low-power cellular modem, a low-power mesh device, and a router between cellular and mesh networks as well as provide multiple connectivity backup options. The rich feature set and performance make it an ideal solution for single-chip asset-tracking applications, bundling multi-tier location services optimized for battery-operated devices.
“Commercial adaptation of the ALT1350 SoC by industry leaders demonstrates strong demand for new generation LPWA technology solutions,” said Nohik Semel, CEO of Sony Semiconductor Israel. “This SoC enables applications for smart cities, logistics and asset trackers, connected health devices, and in the wearables market as it brings in an era of connected everything in which battery consumption is no longer a concern. We are excited to be working with our partners to bring this SoC to the market and help them build innovative products”
“It has been a great experience developing our connectivity module & network device based on the ALT1350 chipset, collaborating with Sony for the first time,” says Jin Gyu Lee, CMO of AM Telecom
“This equips us with a strong competitive edge in LTE network coverage as well as low cost by processing sub-GHz LPWA and LTE-M on a single SoC using the ALT1350.
We believe this is a great opportunity for AM Telecom using small IoT devices based on the ALT1350 chipset which enables technically solving issues such as battery life, WPS/GPS support, etc. disrupting the spread of IoT communications.”
“We are delighted to propel the 5G LPWA module solution in collaboration with Sony, and we are optimistic to bring empowerment in the application fields in the short term with today’s announcement on the commercial availability of the ALT1350,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Fibocom’s 5G LPWA module MS180 integrated with the ALT1350, adopts an ultra-compact size at 12.8*14.8mm and is designed to provide ultra-low power consumption and reliable wireless connectivity for the 5G massive IoT market. Looking forward, we are confident to empower industries such as smart metering, asset tracking, telematics, telehealth, smart city, and consumer electronics with the best-in-class module solution.”
“The collaboration with Sony, an industry leader in cellular IoT connectivity, ensures that Murata delivers unsurpassed feature integration, security, and system cost in the smallest form factor possible,” said Hirokazu Nakae, General Manager of Connectivity Module Product Department, Murata, “Murata’s ALT1350 module is designed to address specifications of vertical markets such as tracking, metering, wearables, and other emerging markets. Looking forward, it will offer worldwide operator certificates to allow customers to launch their product globally with a single design.”
“We are thrilled to be working closely again with Sony on the integration of Sony’s advanced ALT1350 chipset into our module solutions, underscoring our commitment to driving innovation and delivering superior performance to our customers” commented Norbert Muhrer, President and CSO, of Quectel Wireless Solutions. “Our Quectel BG950S-GL LPWA module will take the rich feature set and performance of the ALT1350 and set a new standard for IoT devices, enabling more efficient, reliable, and seamless communication across the globe. Together, Sony and Quectel are paving the way for a future where smart, connected devices transform every aspect of our lives, from the way we work to how we interact with the world around us.”
“Our long-time partnership with Sony has helped us to shape and innovate in the LPWA market, particularly with metering applications,“ said Larry Zibrik, VP and GM of Modules at Semtech. “We are proud to continue our leading role in the evolution of LPWA technology through the use of the Sony’s Altair ALT1350 in our next-generation HL7900 5G LPWA module, building on the success of our HL78 series. With the launch of the HL7900, we look forward to pushing boundaries for customers with even more efficient and long-lasting IoT solutions.”
“The low-power, multi-radio capabilities of the ALT1350 unlock a new set of use cases for the vast battery-driven cellular LPWAN and short range wireless IoT application markets.” said Manish Watwani, Chief Marketing and Product Officer at Telit Cinterion. ”Telit Cinterion is elated to be part of this inflection point in the industry, introducing a strong lineup of modules, namely the ME310M1 Series, based on the SoC made possible not only by the ALT1350 broad set of advanced features, but also by the strong and longstanding partnership we have with Sony.”
“WNC is very excited to launch a module line based on Sony’s ALT1350 chipset and strengthen a broad, strategic partnership with Sony. WNC’s unique value-add in connectivity modules, antenna design, and turnkey ODM/CM services sets us apart from other module and CM players,” said Fayu Chen, SVP & GM of the Automotive, Module, and Antenna Business Group at WNC. “Sony’s Cat-M SoCs are widely regarded as the gold standard in Cat-M technologies. We look forward to the ALT1350’s many cutting-edge features and the new world of opportunities that it will usher in.”
Click here to learn more about the ALT1350 chipset from Sony Semiconductor Israel.
