RFHIC to Release GaN MMICs and Transistors with Significant Advancements Over GaAs MMICs

RFHIC to Release GaN MMICs and Transistors with Significant Advancements Over GaAs MMICs

RFHIC Corporation, a global leader in designing and manufacturing high-performance RF & Microwave components for defense, telecom, and RF Energy applications, plans to release of new line of GaN MMICs, low-noise amplifiers (LNA) and transistors.

Compared to GaAs MMICs, these GaN MMICs from RFHIC provide significant advancements, offering several benefits that make them preferable for various applications. GaN MMICs ensure higher power density capabilities than GaAs MMICs. This higher power density enables GaN devices to handle greater levels of RF power while maintaining efficiency and linearity.

GaN devices exhibit superior thermal properties compared to GaAs, leading to improved reliability and longevity. The inherent thermal conductivity of GaN allows for efficient dissipation of heat, reducing the risk of device failure due to overheating. This thermal robustness is particularly advantageous in demanding operating environments and extended usage scenarios. Furthermore, GaN MMICs offer broader bandwidth capabilities, enabling them to operate over a wider frequency range compared to GaAs MMICs.

GaN MMICs

RFHIC’s GaN MMICs are designed for operation in the C, X, Ku, K and Ka-band, delivering output power from 5 to 80 W. They will be available in surface-mount QFN, CM1012-6L, or CM1012-6L packaging options.

Part Number
Minimum Freq. (GHz)
Maximum Freq. (GHz)
Psat (dBm)
PAE (%)
Vds (V)
Package
M004P6
5.2
6.2
44.5
49
28
QFN 6x6
M012C2C
9
10
42
38
28
CM1016-6L
M011C2C
8.5
9.5
45
37
28
CM1016-6L
M013C2C
10.7
12.7
40
37
28
CM1016-6L
M015C1MH
12.5
17.5
39
38
20
CM1012-6L
M017C2C
14.5
17
44.7
30
22.5
CM1012-6L
M001C1C
15
17.5
47.8
34
22
CM1016-6L
M018C2C
18
22
44.6
26
22.5
CM1012-6L
M014C2C
27
29
36.5
22
28
Development
M016C2C
29.5
30.5
40
15
28
Development

Low Noise Amplifiers

RFHIC’s upcoming GaN low-noise amplifiers (LNAs) are designed for operation from L to Ka-band with noise figures in the range of 1 to 2.4 dB. They will be available in module (hermetic), QFN, or ceramic QFN packaging options. These LNAs are designed for wireless communications and defense applications including WiMax, repeaters, base stations, radar, jammers, EW, and RF Subsystems. Customized solutions are available upon customer request.

Part Number
Minimum Freq. (GHz)
Maximum Freq. (GHz)
Noise Figure (dB)
Vds (V)
Idq (mA)
Package
RRM1214-R1A
1.2
1.4
0.45
15
200
Module
LCL3322-L
2.7
3.8
1.4
5
220
CP-16B
WE327
0.5
7.2
1.8
5
120
DFN 2x2
M008P5C
8
14
1 - 1.2
2
95
QFN 5x5
M009P4C
15
23
1.3 - 1.7
2
50
QFN 4x4
M010P5C
27
32
1.9 - 2.4
2
30
QFN 5x5

Internally-Matched GaN Transistors

RFHIC’s new internally-matched GaN Transistors are designed for S, C and X-band operation, delivering an output power of up to 350 W. They will be available in air-cavity or hermetically-sealed packages and are suitable for wireless infrastructure applications in 4G LTE and 5G macro base stations.

Frequency
S-Band
C-Band
X-Band
Power
350 W
200 W
120 W
Gain (typical)
12 dB
11 dB
8 dB
Package
18.0 x 10.2 mm (Air cavity or Hermetically-sealed package)
Expected Release
2024 2Q

These GaN MMIC families from RFHIC represent a significant leap forward in RF technology, offering an array of advantages over their GaAs counterparts. With higher power density capabilities, superior thermal properties and broader bandwidths, GaN MMICs stand as the preferred solution for high-performance RF applications, delivering excellent efficiency, reliability, and versatility.

Click here to view RF GaN Transistors from RFHIC on everything RF.

Publisher: everything RF

RFHIC

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