Crane Aerospace & Electronics, a segment of Crane Company, has developed a family of beamformer backplane products for space applications utilizing its proprietary Multi-Mix multi-layer laminate technology. Crane A&E's Multi-Mix Microtechnology is an innovative process for fusing multilayer integrated circuits and micro-multifunction modules (MMFM). This process is based on fluoropolymer composite substrates, which are bonded together into a multilayer structure using a fusion bonding process. This technology allows the integration of active and passive functions into self-contained modules that are a fraction of the size of conventional hybrid units.
Key Benefits:
- Integration of active RF and passive RF components
- Reduce size, weight and component costs
- Reduce parts count and complexity
“We are integrating arrays of radiating elements with associated feed networks and RFICs into a single module for space applications throughout the Microwave and mmWave frequency range,” said Jim Logothetis, Director of Engineering, Microwave Solutions. “Fusion bonding is used to increase circuit density, minimize layer count, and reduce the required footprint, which results in the smallest footprint and highest RF performance for these challenging applications.”
The backplane layers contain a series of N-way power dividers and combiners along with matched impedance feed networks to implement the interconnection of any number of beams to any number of elements. Also contained within the layers are DC power planes and radiation shielding. Beamformer backplane/radiator assemblies are typically composed of 15 to 30 laminate layers, with antenna radiating elements on one surface, and RFICs, digital circuitry and blind mate connectors on the opposing surface.
Click here to learn more about Crane A&E’s MMX technology and leading beamforming platform of products.
Crane Aerospace & Electronics showcased their products at IMS 2024 in Washington DC last week. Click here to see everything RF's coverage of the event.
