TDK Corporation has introduced what it claims to be the world's smallest module (As of July 2015) for the latest Bluetooth 4.1 low energy (LE) specification. The ultra-compact dimensions of the new TDK SESUB-PAN-D14580 module are just 3.5 mm x 3.5 mm x 1.0 mm, thus reducing the footprint by over 60 percent compared to modules with discrete components. The module features an integrated DC-DC converter. With a voltage supply of 3.0 V, its current consumption is only 5.0 mA when transmitting, 5.4 mA when receiving and 0.8 µA in standby mode. Its miniature size and low current consumption, make this Bluetooth module ideal for use in battery-powered wearable devices, where small size, light weight, and low power consumption are essential requirements. Mass production started in July 2015.
The SESUB-PAN-D14580 module is based on TDK's SESUB (semiconductor embedded in substrate) integration technology, which features an embedded DA14580 Bluetooth 4.1 chip from Dialog Semiconductor. All terminals of the discrete chip are available, allowing full use of chip functions. The quartz oscillator, capacitors, and various other peripheral components are mounted on the same substrate, enabling the record miniaturization. In addition, the modular approach simplifies the hardware design process.
Bluetooth has established itself as the wireless communication standard of choice to connect wearable devices to smartphones, tablets or PCs, for example. The new SESUB-PAN-D14580 implements Bluetooth 4.1 LE, the latest version of this standard that is also known as Bluetooth Smart, which made it possible to reduce power consumption to about one fourth of conventional Bluetooth devices.
