GCT Semiconductor has introduced the GDM7243A, an LTE-Advanced single-chip solution that operates in four frequency bands – 700 to 900 MHz (low band), 1.4 to 2.1 GHz (mid band), 1.7 to 2.6 GHz (high band), and 3.4 to 3.8 GHz (U-high band). It complies with the 3GPP Release 12 standard and is based on two LTE-Advanced Category 12/15 technologies. This chip communicates using FDD/TDD mode and supports 2CA 4x4 MIMO and 3CA/4CA 2x2 MIMO for enhanced bandwidth and high quality data delivery. It delivers a data rate of 600 Mbps with the 2CA 4x4 MIMO mode.
The GDM7243A primarily consists of an RF transceiver and a baseband unit. The RF unit includes 2 transmit channels and 4 receive channels. The baseband unit supports a dual 1 GHz ARM Cortex-A7 processor (for LTE and application), FDD-LTE/TDD-LTE (3GPP E-UTRA Release 11/12) PHY and MAC layer processing, and a comprehensive set of peripheral and host interfaces (e.g. USIM, UART, parallel 16-bit bus, and NAND controller) for controlling the device.
This single-chip solution also ensures very low power consumption and has a small form-factor. It is available in a flip-chip chip scale package (FcCSP) package that measures 13 x 13.5 x 1.2 mm. This chip is ideal for hostless applications such as hot spots, IDU/ODU CPEs, and M2M devices.
Click here to learn more about the GDM7243A LTE-Advanced Cat 12/15 chip.
GCT Semiconductor is a leading fabless designer and supplier of advanced 4G LTE and 5G semiconductor solutions. GCT’s system-on-chip solutions integrate radio frequency, baseband modem and digital signal processing functions into a single die, therefore offering complete 4G platform solutions with small form factors, low power consumption, high performance, high reliability and cost effectiveness. Click here to learn more about GCT Semiconductor.
