ED2 Corp has introduced Universal Glass Package (UGP100), an innovative surface-mount hermetic solution that delivers exceptional performance at a fraction of the cost of traditional hermetic sealing methods. Engineered for operation beyond 100 GHz, this compact SMT package measures just 3.5 x 4.3 mm and features a copper-based construction for superior heat dissipation and thermal management.
Optimized for high-frequency applications, the UGP100 is an excellent choice for packaging high-frequency amplifiers, attenuators, limiters, or multifunction RF devices operating up to 100+ GHz. Its design ensures minimal performance variation and outstanding repeatability from part to part. Additionally, the UGP100 is RoHS-compliant, meets industry standards, and provides a hermetic sealing solution ideal for demanding environments.
Performance Highlights:
- Engineered for operation beyond 100 GHz
- Temperature stable performance
- Superior heat dissipation
- Hermetic sealed (optional)
- SMT package
Applications:
- Aerospace equipment including aircraft and satellites
- Military/Defense systems including communication equipment, radar systems, and other electronics and devices
- Telecommunications, particularly those for harsh environments
- Instrumentation and controls
- Medical equipment and device
Click here to learn more about UGP100 from ED2 Corp.
