Sequans Communications recently announced that its newest EZLinkLTE module, the US60L, has been certified to operate on AT&T’s 4G LTE network, having achieved technical acceptance (TA) from AT&T’s Network Ready Lab. At the heart of the module is Sequans’ IoT-optimized, LTE Cat 4-capable chipset, Colibri, along with memory, power management and a complete RF front-end, all in a single, affordable, compact, surface-mount package.
The new US60L module is the first in a family of pin-compatible Sequans modules designed for the US LTE market and will be of great value to IoT device designers in several vertical markets as it is an ideal solution for applications in areas including telematics, security, and surveillance, to name a few. It provides an all-in-one connectivity solution that comes pre-integrated and pre-certified, significantly reducing time to market for device makers.
AT&T’s Network Ready Lab program ensures that a module receiving AT&T’s technical acceptance meets AT&T’s performance, interoperability and feature requirements, and that it is approved to operate on AT&T’s 4G LTE network. The US60L module has been certified by AT&T on LTE bands 2, 4, 5 and 12. This module is manufactured by Wistron NeWeb Corporation, a longtime partner of Sequans.
This module is based on Sequans’ Colibri LTE chipset platform and is a member of Sequans’ StreamliteLTE family of LTE for IoT products, providing an extremely cost-effective solution for a wide range of M2M modules and devices requiring higher throughput, as well as for consumer tablets, mobile PCs, and home and mobile routers.
Sequans EZLinkLTE US60L module features:
- Based on Sequans’ Colibri LTE chipset platform
- 3GPP Release 10/11 compliant
- Up to LTE UE Category 4 throughput (150 Mbps DL)
- Fully integrated on-modem VoLTE capable
- Available support for eMBMS and location services
- Support as certified for LTE bands 2,4,5 and 12 (pin-compatible variant adds support for bands 13 and 17)
- PTCRB compliant
- Embedded OMA-DM
- Supports most leading OS options
- IoT-friendly interfaces
- 31.5 x 22 x 1.92 mm LGA package
