Multitest has delivered a production interface solution to a customer for OTA testing of a 60 GHz UltraGig single-chip integrated Antenna in Package (AiP). The solution integrates the xWave OTA Contactor with xWave patch antenna in the MT2168XT lead backer.
This integration of an OTA patch antenna into the lead backer of a production pick and place handler is believed to be the first in the industry. This solution offers a unique and reliable production solution testing an AiP device with 60 GHz RF signals both radiating out of an antenna array in the lid and connected through the ball grid array. It leverages knowledge on RF signal integrity and the ability to integrate this interface solution into a state-of-the art test handler for high volume production. In this application an OTA manual actuator clone of the handler lead-backer was also provided to accelerate test program debug activities.
xWave OTA Contactors have also been used for testing of 76-81 GHz AiP automotive radar devices and are being designed for 5G applications at 28 GHz and 39 GHz. Radiation patterns and directivity vary by application out the top, sides and/or bottom of the AIP.
The xWave contactor utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cm-Wave and mm-Wave devices. Inside the xWave contactor are embedded patch antennas and coplanar waveguides for both wireless and wired communication. In addition to wireless communication xWave contactors minimize the number of transitions between the DUT and tester through the use of co-planar waveguide structures that make direct connection with the DUT, bypass the PCB, and connect to the tester with either coaxial cable or waveguides.
