AVX Corporation has introduced a new line of ultra-miniature, thin-film transmission line capacitors for DC blocking in high-frequency links operating in the UHF range (300 MHz – 3GHz). The new capacitors have a novel metal-insulator-metal (MIM) structure, copper traces for optimal circuit conductivity, a transmission line wire-bond pad, and a gold-metalized backside ground, and can be supplied on a variety of low-loss substrates, including quartz, alumina, glass, and silicon.
The new transmission line capacitors are also available in a wide range of capacitance values: 0.350pF with a ±20% tolerance and each is made using a high-frequency structure simulator (HFSS) to proactively address any electromagnetic challenges and provide the highest possible RF performance and reliability.
The capacitors are available in three standard substrate thicknesses: 5, 10, and 15 mils (0.005, 0.01, 0.015”) and two standard substrate widths: 20 and 40mils (0.02–0.04”), and have design-dependent lengths determined by transmission line dimensions. Average lengths are generally in the realm of 20–80mils (0.02–0.08”), but lengths up to and beyond 320mils (0.32”) are not altogether uncommon.
The capacitors are rated for up to 100V, have specific capacitance values ranging from 50–100pF/mm2, a dissipation factor of less than 0.1%, and a TCC value of ±60ppm/ºC. They exhibit 50Ω standard impedance. Custom impedance values, substrate materials, and substrate thicknesses are available upon request. The capacitors are also RoHS compliant and are tested to MIL-STD-883-2011.8 for bond strength, MIL-STD-883-2018 for shear strength, and MIL-STD-202-108 for lifetime. Packaging options include: antistatic waffle pack, tested but un-diced, and tested and diced on tape, and lead-time for the series is currently 14 weeks.
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