At CS ManTech, StratEdge Corporation is showcasing its thermally-efficient packages for compound semiconductor devices, such as gallium nitride (GaN) and gallium arsenide (GaAs). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed-signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS.
The CS ManTech Conference brings together compound semiconductor professionals from around the world to share information, to exchange ideas, and to establish ties within the community. The conference is being held from April 29-May 1 at the Hyatt Regency, Minneapolis, MN.
StratEdge uses hardened, or post-fired, ceramic that does not shrink, resulting in complete dimensional stability and precise mechanical tolerances. StratEdge then mates these ceramics with its patented electrical transition designs to manufacture semiconductor packages with exceptionally low electrical losses that operate efficiently, even at frequencies as high as 63 GHz. StratEdge offers complete automated assembly services for these packages, including gold-tin solder die attach.
Click here to learn more about StratEdge.
