Note: This event has now moved to October 2020. Click here to read the latest news story.
Following the developments of the coronavirus (COVID-19) outbreak closely and its impact on colleagues and customers in China, Horizon House, the publisher of Microwave Journal and organizer of the event, has announced that EDI CON CHINA, which was meant to take place in Beijing, China from May 12 to 13, 2020, has been rescheduled for September 27 and 28, 2020.
Ivar Bazzy, President of Horizon House said that ‘We express our sincere thanks to our exhibitors, sponsors, and media partners for their ongoing support of EDI CON CHINA, and we send our very best wishes to our colleagues, friends, and customers who are directly affected by the COVID-19 virus. We thank everyone for their patience as we shift to a new date for our 2020 event in the fall in Beijing.’
EDI CON CHINA brings together speakers, exhibitors, and engineers who are focused on high-frequency analog and high-speed digital designs. The event includes a robust expo floor filled with industry-leading vendors as well as workshops, panels, forums, and a peer-reviewed conference program that aim to increase knowledge of engineering techniques, methodologies, and technical concepts.
Major sponsors include Host Sponsor Keysight Technologies and Diamond Sponsor Rohde & Schwarz. Gold sponsors include Xiamen San’an Integrated Circuit Co., Ltd., WIN Semiconductors Corporation, Sichuan YiFeng Electronic Science & Technology Co., Ltd, Richardson RFPD, and Mini-Circuits. More information, including an application to exhibit or to participate in the SOI Forum, is available on the official website.
Click here for the latest updates from EDI CON CHINA.
