RF & Microwave Industry News | Page 305
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Amphenol RF is pleased to offer a wide selection of waterproof IP67-rated HD-BNC connectors. These connectors are designed specifically for use in applications where the syste... Read More
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IDTechEx's recent research into Thermal Management for 5G has found innovations occurring within the semiconductor technology (CMOS, SiGe, GaN, etc.), thermal interface materi... Read More
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SAE Media Group have announced that the 24th Annual Global MilSatCom Conference and Exhibition will return to London on the 8th, 9th, 10th November 2022, alongside a SATCOM On... Read More
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3D Glass Solutions (3DGS), an innovative pure-play glass foundry, announces its main LC-IPD process line on APEX® photosensitive glass ceramic is ready for volume production.
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The Wireless Broadband Alliance (WBA) has published “Wi-Fi 6/6E for Industrial IoT: Enabling Wi-Fi Determinism in an IoT World”. This paper explores how Wi-Fi’s latest feature... Read More
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Semtech Corporation, a leading global supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced its breakthrough SaaS chip-to-Clou... Read More
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Ericsson has announced an agreement with the National Science Foundation-funded Platforms for Advanced Wireless Research (PAWR) program to supply Ericsson’s industry-leading a... Read More
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Mercury Systems, a leader in trusted, secure mission-critical technologies for aerospace and defense, announced that it received a $10 million award to provide an innovative p... Read More
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Antenova, a UK-based manufacturer of antennas and RF modules for M2M and the IoT, has launched the GNSSNOVA M20071, a new GNSS receiver module, with lower power consumption to... Read More
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Qorvo®, a leading provider of innovative RF solutions that connect the world, announced the availability of the ACT41000-104-REF1, a GaN power amplifier (PA) biasing reference... Read More
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Guerrilla RF has announced that it is now sampling the GRF5317, the first of a series of new 0.1W linear power amplifiers being developed by the company. These latest InGaP HB... Read More
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DuPont Microcircuit and Component Materials (MCM), a company that develops substrate films for electronics targeting various applications such as automotive, industrial, telec... Read More
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Sivers Semiconductors has completed the integration of MixComm, creating a strong global challenger in 5G, SATCOM and radar. Along with broadening Sivers’ portfolio, and incre... Read More
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Sensata Technologies has announced that it has developed a new Bluetooth Low Energy (BLE) Tire Pressure Monitoring System (TPMS) for vehicle OEMs to help improve vehicle safet... Read More
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Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the company's first semiconductor chip design center i... Read More
