FM160-NA

Cellular Module by Fibocom (92 more products)

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FM160-NA Image

The FM160-NA from Fibocom is a 3G/4G/5G NR Sub-6 GHz Module that is designed for IoT applications in the North American region. It delivers a downlink data rate of up to 3500 Mbps and an uplink data rate of up to 900 Mbps. The module is powered by a Qualcomm Snapdragon X62 modem chipset and is backward compatible with LTE/WCDMA. It consists of a multi-constellation GNSS receiver (GPS/ Galileo/GLONASS/ BeiDou) which provides high-performance positioning and navigation. This module supports 4x4 MIMO, CS Voice, VoLTE, VoNR, SMS, SMS over IP (IMS), and SMS over NAS features.

The FM160-NA requires a DC supply of 3.135-4.4 V and can be controlled via USB 3.1/3.0/2.0, PCIe 4.0, GPIO UIM, and I2S interfaces. It is available in an M2 package that measures 30.0 x 52.0 x 2.3 mm with 4 antenna interface pins and is ideal for cellular terminals like CPE, STB, IPC, and ODU covering most mobile networks in the North American region.

Product Specifications

Product Details

  • Part Number
    FM160-NA
  • Manufacturer
    Fibocom
  • Description
    Sub-6 GHz Cellular Module for IoT Applications in North America

General Parameters

  • Region
    NAFTA
  • Carrier
    T-Mobile, AT&T, Verizon
  • 5G Bands
    n2, 5, 7, 12, 13, 14, 25, 26, 30, 41, 48, 53, 70, 71, 66, 77
  • Fallback
    NA
  • GNSS Standard
    GPS, Glonass, BeiDou, Galileo, QZSS
  • AT Command
    Yes
  • LTE/4G Band
    B2, B4, B5, B7, B12, B13, B14, B25, B26, B29, B30, B66, B71, B41, B43, B46, B48
  • UMTS/HSPA/3G/WCDMA Band
    B2, B4, B5
  • IoT
    Yes
  • MIMO
    Yes
  • Certification
    FCC, IC, GCF, PTCRB
  • Drivers
    Linux, Windows, Android
  • Form Factor
    M.2
  • Generation
    5G, 4G/LTE, 3G
  • Interface
    USB 3.1, 3.0, 2.9, PCIe 4.0, UART, SPI, GPIO, I2C, SDIO, UIM, I2S, RGMII, eSIM
  • Data Rate
    5.67 to 3500 Mbps
  • Datarate Download Link
    42 to 3500 Mbps
  • Datarate Uplink
    5.67 to 900 Mbps
  • Integrated Features
    GNSS
  • Voltage
    3.135 to 4.4 V
  • Size
    30 x 52 x 2.3 mm
  • Operating Temperature
    -30 to 75 Degree C
  • Package Type
    Surface Mount
  • Processor
    Qualcomm Snapdragon® X62
  • Sms
    Yes
  • Voice
    Yes