The 92ML from Rogers Corporation are thermally enhanced laminates and prepregs, specifically engineered and manufactured to meet the demands of high power applications. They are halogen-free, flame retardant, thermally conductive epoxy based prepregs and laminates. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics.
These materials are ideal for multilayer applications requiring thermal management throughout the entire board. These laminates are available with up to 4oz copper cladding; thick enough to meet most demanding power distribution requirements. The high thermal conductivity of up to 3.5 W/mK (in-plane) in combination with the relative ease and familiarity of epoxy based systems makes this material an ideal candidate for applications such as motor controllers, power supplies, converters, automotive electronics, etc. The relatively high Tg value of 160°C in combination with a low Z-axis coefficient of thermal expansion of 22ppm/°C (<Tg) and 175ppm/C (>Tg) ensure that these materials survive lead free solder exposures and board reliability testing. The excellent rheological characteristics of the prepregs enable a high degree of resin flow; a critical element of high power multi-layer board processing.
