The TSM-DS3 family from Taconic is range of thermally stable, low loss laminates with very low fiberglass content (around 5%). These laminates are developed for high power applications and to have very low coefficients of thermal expansion for demanding thermal cycling. They have a high thermal conductivity of 0.65 W/m*K and low loss cores (Df = 0.0011 at 10 GHz). These ceramic-filled reinforced materials can be used in couplers, phased array antennas, radar manifolds, and oil drilling and automotive applications.
