LBEE5XV1YM

RF Module by Murata (102 more products)

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The Type 1YM (LBEE5XV1YM) from Murata is a 2.4/5 GHz Dual-Band Wi-Fi and Bluetooth 5.2 Combo Module that is designed for IoT applications. It is based on NXP’s 88W8997 chipset and supports DSSS, CCK, and OFDM modulation techniques. The 88W8997 chipset implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorithms, which ensure that WLAN and Bluetooth® collaboration is optimized for maximum performance. It supports Wi-Fi® 802.11 (a/b/g/n/ac) 2x2 MIMO and Bluetooth® 5.2 BR/EDR/LE with a PHY data rate of up to 866 Mbps (Wi-Fi) and 3 Mbps (Bluetooth). In IEEE 802.11ac mode, the WLAN operation supports rates of MCS0 - MCS9 (up to 256 QAM) in 20 MHz, 40 MHz, and 80 MHz channels for data rates up to 866 Mbps.

This module requires a DC supply of 1.8/3.3 V. It provides a Wi-Fi Tx power of 17 dBm (@2.4GHz) and has an Rx sensitivity of -97 dBm. The WLAN section supports PCIe v3.0 Gen 1/Gen 2 rate (2.5/5 Gbps), and SDIO 3.0 interfaces while the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data. It is available in a surface-mount package that measures 11.8 x 8.4 x 1.3 mm and is ideal for industrial IoT, smart homes, audio/4K video/voice, and gateway applications.

Product Specifications

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Product Details

  • Part Number
    LBEE5XV1YM
  • Manufacturer
    Murata
  • Description
    2.4/5 GHz 2x2 MIMO Wi-Fi 5 + Bluetooth 5.2 Combo Module

General Parameters

  • Technology
    WiFi + Bluetooth
  • Application
    IoT, Handheld wireless system, Gateway
  • Frequency
    2.4 to 5.825 GHz
  • Bluetooth Standards
    Bluetooth v5.2
  • WiFi Standards
    802.11a/b/g/n/ac
  • Data Rate
    3 to 866 Mbps
  • Modulation
    DSSS / CCK / OFDM
  • Supply Voltage
    2.2 to 6 V
  • Current Receiving
    110 to 160 mA
  • Current Transmitting
    380 to 470 Ma
  • Output Power
    10 to 19 dBm
  • Sensitivity
    -51 dBm
  • Integrated Antenna
    No
  • Interface Type
    PCIe, PCM, UART, USB, SDIO
  • Chip
    NXP (88W8997)
  • Package
    LGA
  • Weight
    352 mg
  • Mounting Type
    Surface Mount
  • Dimension
    11.8 x 8.4 x 1.3 mm
  • Operating Temperature
    -30 to 85 Degree C
  • RoHs
    Yes

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