The MGM210P is a pre-certified module that supports Zigbee, Thread, Bluetooth 5.1, Bluetooth Mesh or multi-protocol (Zigbee + Bluetooth 5.1) connectivity and networking capabilities. This multiprotocol module has an optimized form-factor with an integrated chip antenna and low profile for space-constrained IoT designs including smart lighting, HVAC, building, and factory automation systems.
Built around the EFR32MG21 Wireless Gecko Series 2 SoC, this module has a powerful Arm® Cortex®-M33 processor, best-in-class software stacks, a dedicated security core and a +125 oC temperature rating suited for harsh environmental conditions. Pre-certified for North America, Europe, Korea and Japan, it has an integrated RF power amplifier that makes the module ideal for long-range Bluetooth Low Energy applications requiring hundreds of meters of line-of-sight connectivity. The module measures 12.9 x 15 x 2.2 mm and is ideal for smart home, commercial and industrial applications.
