The UGP100 from ED2 Corp is an SMT Glass Package that is designed for operation beyond 100 GHz. It has a copper-based construction for superior heat dissipation & thermal management and has room for 8 Single Layer Caps (SLCs). This package uses hermetic sealing technology to protect sensitive components and is ideal for packaging high-frequency amplifiers, attenuators, limiters, or other multifunction RF devices operating up to 100+ GHz. It can withstand a temperature range of -40°C to +85°C and has an MSL2A moisture sensitivity level.
This package measures 3.5 x 4.3 x 0.15 mm (without lid) and 3.5 x 4.3 x 0.60 mm (with lid). It is ideal for aerospace equipment including aircraft & satellites, military/defense systems including communication equipment, radar systems, etc., telecommunications - particularly those for harsh environments, instrumentation & controls, and medical equipment applications.
