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Note : Your request will be directed to Microchip Technology.
The C04-115 from Microchip Technology is a RF Package with Terminal Count 20, Lead Pin Thickness 0.008 to 0.014 Inches, Lead Pitch 0.100 Inches. Tags: C-DIP. More details for C04-115 can be seen below.
SMT Glass Package for 100+ GHz Operation
PCB Surface Mount RF Package
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