C04-21466

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C04-21466 Image

The C04-21466 from Microchip Technology is a RF Package with Terminal Count 625, Lead Pitch 1 mm (Contact), Package Thickness 4.29 mm. Tags: CLGA. More details for C04-21466 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-21466
  • Manufacturer
    Microchip Technology
  • Description
    625-Terminal Ceramic Land Grid Array

General Parameters

  • Terminal Count
    625
  • Lead Pitch
    1 mm (Contact)
  • Mounting
    Surface Mount
  • Package Size
    29 x 29 x 4.29 mm
  • Package Thickness
    4.29 mm
  • Type
    CLGA

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