C04-25064

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C04-25064 Image

The C04-25064 from Microchip Technology is a RF Package with Terminal Count 1069, Lead Pitch 0.80 mm, Package Thickness 0.75 mm. Tags: BGA. More details for C04-25064 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-25064
  • Manufacturer
    Microchip Technology
  • Description
    1069-Ball Fine-Pitch Ball Grid Array

General Parameters

  • Terminal Count
    1069
  • Lead Pitch
    0.80 mm
  • Mounting
    Surface Mount
  • Package Size
    27 x 27 x 3.26 mm
  • Package Thickness
    0.75 mm
  • Type
    BGA

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