C04-25215

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C04-25215 Image

The C04-25215 from Microchip Technology is a RF Package with Terminal Count 480, Lead Pitch 1 mm, Package Thickness 1.20 mm. Tags: BGA. More details for C04-25215 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-25215
  • Manufacturer
    Microchip Technology
  • Description
    480-Ball Thick Ball Grid Array

General Parameters

  • Terminal Count
    480
  • Lead Pitch
    1 mm
  • Mounting
    Surface Mount
  • Package Size
    23 x 23 x 3.32 mm
  • Package Thickness
    1.20 mm
  • Type
    BGA

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