C04-25216

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C04-25216 Image

The C04-25216 from Microchip Technology is a RF Package with Terminal Count 672, Lead Pitch 1 mm, Package Thickness 0.60 mm. Tags: BGA. More details for C04-25216 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-25216
  • Manufacturer
    Microchip Technology
  • Description
    672-Ball [Standard] Ball Grid Array

General Parameters

  • Terminal Count
    672
  • Lead Pitch
    1 mm
  • Mounting
    Surface Mount
  • Package Size
    27 x 27 x 2.24 mm
  • Package Thickness
    0.60 mm
  • Type
    BGA

Technical Documents