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QP-QFN100-12MM-.4MM

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QP-QFN100-12MM-.4MM Image

The QP-QFN100-12MM-.4MM from QP Technologies is a RF Package with Terminal Count 100, Lead Pitch 0.4 mm, Package Thickness 0.800 mm. Tags: OmPP, QFN. More details for QP-QFN100-12MM-.4MM can be seen below.

Product Specifications

Product Details

  • Part Number
    QP-QFN100-12MM-.4MM
  • Manufacturer
    QP Technologies
  • Description
    OmPP, QFN, Cavity Surface Mount 100 Lead RF Package

General Parameters

  • Applications
    Military
  • Finish
    Electroless Nickel, Gold
  • Terminal Count
    100
  • Lead Pin Material
    Copper 194FH
  • Lead Pitch
    0.4 mm
  • Mounting
    Surface Mount
  • Package Material
    Semiconductor Molding Epoxy
  • Package Size
    12 mm
  • Package Thickness
    0.800 mm
  • Type
    OmPP, QFN

Technical Documents
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