The MASW-011053 is a HMIC Silicon PIN Diode SP3T Switch with Integrated Bias Network that operates from 2 to 18 GHz. It has a low insertion loss and high isolation. The switch has a switching speed of 50 ns and can handle up to 50 dBm of power (IP3). Large bond pads facilitate the use of low facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding. The switch is available as a Die in gel pack or in waffle pack.
