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RF Packages - Page 2

570 RF Packages from 9 Manufacturers meet your specification.
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QFN-3312-0521 Image
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Barry Industries - QFN-3312-0521

RF Package from Barry Industries
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Description:12 Pin HTCC Air Cavity QFN Package from DC to 40 GHz
Type:
QFN, HTCC
Insertion Loss:
0.5 to 4 dB
Terminal Count:
12
Mounting:
Surface Mount
Package Material:
Alumina (Al2O3)
Package Thickness:
0.95 mm
Package Size:
3 x 3 mm
Terminal Type:
Pin
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SOT1258-1 Image
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Ampleon - SOT1258-1

RF Package from Ampleon
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Description:Air-Cavity Plastic (ACP) Surface Mount 6 Lead RF Package
Type:
ACP
Terminal Count:
6
Mounting:
Surface Mount
Package Size:
16.71 x 32.33 x 4.65 mm (W x L x T)
Terminal Type:
Lead
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KD-76135-G Image
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KYOCERA - KD-76135-G

RF Package from KYOCERA
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Description:16 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.1 x 4.32 mm
Terminal Count:
16
Mounting:
Through Hole
Package Size:
20.32 x 7.87 mm (C x D)
Terminal Type:
Lead
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StratEdge - G1111M-1

RF Package from StratEdge
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Description:Flatpack Surface Mount 6 Lead RF Package
Type:
Flatpack
Terminal Count:
6
Mounting:
Surface Mount
Package Material:
Glass
Terminal Type:
Lead
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PSP35B10S Image
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Nuvotronics, Inc. - PSP35B10S

RF Package from Nuvotronics, Inc.
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Description:MMIC PCB, Surface Mount RF Package from 30 to 40 GHz
Type:
PolyStrata
Mounting:
PCB, Surface Mount
Package Material:
Copper
Package Thickness:
1.66 mm
Package Size:
1.66 x 9 x 4 mm (T x L x W)
more info
CQF16002 Image
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Spectrum Semiconductor Materials - CQF16002

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 160 Lead RF Package
Type:
CQFP
Cavity Size:
0.512 x 0.512 Inches (L x W)
Terminal Count:
160
Mounting:
Surface Mount
Package Size:
1.102 x 1.102 Inches (L x W)
Terminal Type:
Lead
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QP Technologies - 235-00125

RF Package from QP Technologies
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Description:QFN Surface Mount 52 Lead RF Package
Type:
QFN
Terminal Count:
52
Mounting:
Surface Mount
Package Size:
6 x 6 mm
Terminal Type:
Lead
more info
RF708 Image
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Materion Corporation - RF708

RF Package from Materion Corporation
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Description:2 Lead LDMOS Style, RF & Microwave Package
Type:
Flange
Terminal Count:
2
Mounting:
Surface Mount
Terminal Type:
Lead
more info
C04-25466 Image
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Microchip Technology - C04-25466

RF Package from Microchip Technology
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Description:896-Ball Standard Ball Grid Array
Type:
BGA
Terminal Count:
896
Mounting:
Surface Mount
Package Thickness:
0.60 mm
Package Size:
31 x 31 x 2.24 mm
Terminal Type:
Ball
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QFN-3312-0522 Image
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Barry Industries - QFN-3312-0522

RF Package from Barry Industries
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Description:12 Pin HTCC Air Cavity QFN Package from DC to 40 GHz
Type:
QFN, HTCC
Insertion Loss:
0.5 to 4 dB
Terminal Count:
12
Mounting:
Surface Mount
Package Material:
Alumina (Al2O3)
Package Thickness:
0.95 mm
Package Size:
3 x 3 mm
Terminal Type:
Pin
more info
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