1. everything RF
  2. Videos
  3. IMS 2012 - Electrical-Thermal Coupled Solutions for Flip Chip Designs

IMS 2012 - Electrical-Thermal Coupled Solutions for Flip Chip Designs

Identifying thermal "hot spots" is an important task in the design of high-power devices such as MMICs, modules and flip chips. Electrical models performance are heavily influenced by operating temperature.