Pushing the Boundaries of Packaging Innovation

As functions become more complex it is necessary to consider how the role of packaging can affect the design-in-process. We simplify product designs with easy-to-use packages that allow the MMIC design to be realized in both surface mount and connectorized forms, as well as solutions that combine multiple functions into one package. By co-designing the die and package, Marki Microwave ensures optimal performance at the board level. From our chip scale packaging (CSP) that delivers up to 90 GHz in a surface mount footprint to the flexible, multi-octave M-Package designs that enable DC to 120 GHz in a connectorized form, Marki Microwave continues to lead in packaging innovation.