Overcome RFIC and RF Module Implementation Challenges

Implementation of RF SiP or modules is plagued with mistakes resulting from using disjointed design tools across multiple design teams. IC design teams use one implementation platform, and the SiP team uses another. If the RF module contains acoustic filters or MMIC, it will usually require yet another design platform. Solving a relatively “simple” problem, like verifying connectivity (LVS) and ensuring a designer aligns the bump pads or connects bond wires correctly, is proving to be challenging. Learn about module implementation challenges and a comprehensive solution to streamline manufacturing using the Cadence® Virtuoso® design platform and Allegro® interoperability, including schematic-driven SiP implementation flow, RFIC and RF module co-design environment for simultaneous editing across chip, module, and package designs, and streamlining manufacturing solutions.