New Thermoset Polymer PCB Materials Raise the Bar for Automotive Radar Applications

This webinar explains how the stringent requirements for PCBs used in automotive radar can be met with high performance thermoset polymer systems. These requirements include:

• Compatibility with both RF and high speed digital performance for single system-on-chip solutions
• Predictable dimensional stability
• Low loss, controlled dielectric constant
• Lead-free construction
• Tight-pitch packaging
• Conductive anodic filament (CAF) resistance

The webinar will review the characteristics of PTFE-based materials, highly filled hydrocarbon based materials and new thermoset polymers. A case study will illustrate how high performance thermoset PCB materials can replace PTFE-based materials to achieve better performance and reliability.

Presenter Bio: 
Mike Miller is the senior manager for military and aerospace and a microwave design specialist for the OEM marketing team at Isola Group. He has more than 25 years experience in RF/microwave and electromagnetics, having held senior engineering positions at General Atomics, ANSYS, Boeing, Northrop Grumman and Lockheed-Martin. His career has focused on antenna and radome design; engineered EM material design, simulation and applications; and RF subsystems and channels. Mike has specialized in the application of computational electromagnetic tools. He holds an MSEE degree from Arizona State University and has co-authored seven patents in antennas and electromagnetically tailored materials. He is an active participant in the Electromagnetic Code Consortium and a member of NDIA and IEEE.